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Semiconductor Ceramics

Technical ceramic parts for the semiconductor industry

Advanced Ceramic Parts for Semiconductor Industry

Semiconductor ceramic parts belong to advanced ceramics and are typically manufactured using high-purity, ultrafine ceramic raw materials. Semiconductor equipment requires a large number of precision ceramic parts. The high hardness, high elastic modulus, wear resistance, good insulation, corrosion resistance, and low coefficient of thermal expansion of ceramics make them widely used in components of equipment such as silicon wafer polishing machines, oxidation/diffusion heat treatment equipment, lithography machines, deposition equipment, semiconductor etching equipment, and ion implanters. In semiconductor chip manufacturing, precision ceramic components such as ceramic robotic arms, vacuum chucks, electrostatic chucks, ceramic heaters, nozzles, and insulation cylinders are key components that are difficult to replace. They are used in major processes such as thin film deposition, etching, oxidation diffusion, and laser annealing in semiconductor wafer manufacturing. For any custom semiconductor ceramic parts requirements, please contact us.

1. What ceramic material is best for semiconductor equipment?

In semiconductor equipment, a large number of oxide ceramic precision components are widely used. For example, aluminum oxide ceramics are commonly applied as protective materials in etching chambers and internal chamber parts. They are also used in polishing plates, conditioning platforms for polishing pads, and vacuum chucks. Silicon carbide (SiC) offers extremely high elastic modulus, high thermal conductivity, and a low coefficient of thermal expansion. Because of these properties, it resists bending stress, deformation, and thermal strain very effectively. As a result, SiC is highly advantageous for precision structural components in critical semiconductor equipment, including lithography systems. Silicon nitride (Si3N4) is often referred to as the “ceramic material with the best overall performance balance.” In semiconductor ceramic components, it is used for platforms, guide rails, bearings, and other motion-related components where strength, wear resistance, and stability are required.

Alumina Al2O3/Aluminum Oxide Ceramic

Zirconia ZrO2/Zirconium Oxide Ceramic

Silicon Carbide SiC Ceramic

Silicon Nitride Si3N4 Ceramic

2. Semiconductor Ceramic Components We Manufacture


Ceramic End Effectors for Semiconductor	Alumina Ceramic Components for Semiconductor	Alumina Ceramic Tube for Semiconductor Equipment	Semiconductor Ceramic Plate	Alumina Ceramic Guide Rail for Semiconductor Lithography Equipment
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3. Precision Machining Capabilities

Dimensional Tolerance	±0.001mm
Flatness	0.005mm
Parallelism	0.003mm
Surface Finish	Ra 0.01μm
Maximum Length	3200mm

4. Manufacturing Processes

Mingrui Ceramic | Advanced Technical Ceramics & Industrial Precision Ceramics

5. Case Study

99.5% High Purity Alumina Ceramic Tube and insulation components

Application: This large-size, high-purity alumina ceramic tube is intended for use in a crystal growth furnace in the Semiconductor Industry and Optical Transceiver Module Industry. A crystal growth furnace is a specialized high-temperature furnace used for growing crystals, commonly applied in the semiconductor, photovoltaic, and optoelectronic industries.

Operating Condition: The furnace can reach temperatures of 1000–2000°C or higher and operates under high vacuum or an inert gas atmosphere for protection. High-temperature thermal processing environments, where thermal stability and contamination control are critical.

Mingrui Ceramic | Advanced Technical Ceramics & Industrial Precision Ceramics

7. Why Choose Mingrui Ceramic

35,000㎡ Manufacturing Plant
500+ Employees
300+ Production Equipment
20+ Engineers
10M+ Parts/year
2500+ Customers

8. FAQ of Semiconductor Ceramic Parts

1. Do you support custom designs or only standard parts?

We specialize in custom ceramic components. All parts are produced based on customer drawings, specifications, and application requirements.

2. Can ceramic parts withstand plasma environments?

Yes. Materials like high-purity alumina, SiC, and Si₃N₄ are widely used in plasma etching and deposition systems due to their excellent plasma corrosion resistance.

3. What tolerances can you achieve?

We can achieve: Dimensional tolerance: down to ±0.001 mm (for precision-ground parts)

Flatness: up to 0.005 mm level

Surface roughness: Ra as low as 0.01–0.02 μm

4. What is the typical lead time for semiconductor ceramic parts?

Lead time depends on complexity and quantity, but typically: Prototype: 2–4 weeks, Mass production: 4–8 weeks, Urgent projects can be discussed separately.